Cross-technology partner for enclosure and system solutions
Straubenhardt, September 10, 2018 - POLYRACK TECH-GROUP will be presenting itself at the world's leading trade fair "electronica 2018" (November 13-16 in Munich) in Hall A2, Stand 402 as a cross-technology partner for customer-specific enclosure and system solutions for global use.
Representative product developments with various solution approaches and materials demonstrate the comprehensive expertise of POLYRACK TECH-GROUP in mechanics, plastics technology, surface processing, electronics, assembly and mounting. The solutions range from small to large components for a wide variety of industries in global markets:
POLYRACK will also be presenting modular and scalable enclosure series as further highlights at the trade fair:
All POLYRACK solutions are characterized by the appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the target market.
You can find our trade fair guide here!
Cross technological partner for enclosure and systems solution
Straubenhardt, Germany, September 10, 2018 - The POLYRACK TECH-GROUP will be presenting itself as a cross technological partner for standard and customized enclosures and systems solution for the global demands at the electronica 2018 (November 13 - 16 in Munich) in hall A2, booth 402.
Representative product developments with various materials and approaches for solutions demonstrate the overall competence of the POLYRACK TECH-GROUP throughout the mechanics, plastics technology, surface treatment, electronics, assembly and testing. The results range from small to large components for a variety of industries in global markets:
Further highlights of POLYRACK products at the exhibition display are demonstrated with modular and scalable enclosures:
All POLYRACK solutions are characterized by an appropriate interaction of mechanics, plastics, electronics and surface finish - adjusted to the target market.
Cross technological partner for enclosure and systems solution
Straubenhardt, Germany, September 10, 2018 - The POLYRACK TECH-GROUP will be presenting itself as a cross technological partner for standard and customized enclosures and systems solution for the global demands at the electronica 2018 (November 13 - 16 in Munich) in hall A2, booth 402.
Representative product developments with various materials and approaches for solutions demonstrate the overall competence of the POLYRACK TECH-GROUP throughout the mechanics, plastics technology, surface treatment, electronics, assembly and testing. The results range from small to large components for a variety of industries in global markets:
Further highlights of POLYRACK products at the exhibition display are demonstrated with modular and scalable enclosures:
All POLYRACK solutions are characterized by an appropriate interaction of mechanics, plastics, electronics and surface finish - adjusted to the target market.
Based on its EmbedTEC enclosure series, POLYRACK presents a versatile enclosure solution for "small" form factors (SFF = Small Form Factor). The visually appealing aluminum desktop case is the elegant packaging for embedded boards of the form factors
It features a replaceable I/O shield and a solid aluminum lid for heat dissipation. This can be replaced with a heatsink for higher performance if required.
Based on its system platform EmbedTEC POLYRACK shows a versatile housing solution for small form factor boards (SFF). The visually appealing aluminum desktop housing is the elegant enclosure for small form factor boards e.g.
It comes with an interchangeable I/O-shield and a massive aluminum cooling plate on top. If necessary this plate can be replaced with a heatsink.
Based on its system platform EmbedTEC POLYRACK shows a versatile housing solution for small form factor boards (SFF). The visually appealing aluminum desktop housing is the elegant enclosure for small form factor boards e.g.
It comes with an interchangeable I/O-shield and a massive aluminum cooling plate on top. If necessary this plate can be replaced with a heatsink.
POLYRACK TECH-GROUP will be presenting a variety of enclosure systems for embedded systems at MtoM & Objets Connectés - Embedded Systems (March 21-22, 2018 in Paris) in Hall 5.3, Stand F26. Customer-specific system applications including electronics integration and a selection of HMI and MMI applications will demonstrate the possibilities for use in various industries and areas of application.
The POLYRACK TECH-GROUP will be presenting at the MtoM & Objets Connectés - Embedded Systems (March 21-22, 2018 in Paris) in hall 5.3, booth F26 their wide range of case and system solutions for embedded systems. Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
POLYRACK TECH-GROUP will be presenting its wide range of housings for embedded systems at the MtoM & Objets Connectés - Embedded Systems trade fair (21-22 March 2018 in Paris) in hall 5.3, stand F26. The company has a very strong dominance in personalized solutions and on measure, up to the possibility of realizing a pre-integration of electronics or the conception of IHM / M2M peuvant être utilisé dans différents domains.
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POLYRACK at MtoM & Objets Connectés - Embedded Systems: Hall 5.3, Booth F26
Straubenhardt, February 9, 2018 - POLYRACK TECH-GROUP will be presenting a wide range of enclosure systems for embedded systems at MtoM & Objets Connectés - Embedded Systems (March 21-22, 2018 in Paris) in Hall 5.3, Stand F26. Customized system applications including electronics integration and a selection of HMI and MMI applications will demonstrate the possibilities for use in various industries and areas of application.
POLYRACK presents the PanelPC 2 series for the embedded sector, especially for industrial environments. It is available with protection class IP54 in sizes from 10.1'' to 21.5'' and in different material variants from milled aluminum to sheet metal bending solutions. Resistive single-touch or multi-touch capable capacitive touchscreens (PCAP) in different glass thicknesses are available as user interfaces. Customized printing and anti-fingerprint coatings are available on request. For the realization of individual requirements POLYRACK uses the advantages of different materials, e.g. plastic and cast iron - also in material combination.
Small Form Factor with EmbedTEC: The aluminum desktop case is the elegant package for small form factors like embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs like the Raspberry Pi. It features a replaceable I/O shield and a solid aluminum lid for heat dissipation. For higher performance, this can be replaced with a heatsink, and perforated side panels and fans further increase cooling performance if required. For applications in the field of automation and IoT, POLYRACK also offers a wide range of adaptations and mounting options.
The Rugged MIL ½ Short ATR Chassis heavy-duty enclosure platform is designed specifically for harsh environments. Available as a salt-brazed aluminum construction and as a sheet metal bending solution to ARINC 404A, it protects electronic components from mechanical, climatic, chemical and electrical influences. The platform is passively cooled and complies with MIL Standard 810 and ARINC 404A specifications. POLYRACK also offers additional cooling options with active, hybrid (passive and active) and liquid. With backplanes according to VITA (VMEbus, VME64x, VPX, OpenVPX) or PICMG standard (CPCI, CPCI Serial, CPCI Plus I/O), power supplies and I/O connection cards, the ATR chassis can be configured to form a complete system.
As further highlights at the fair POLYRACK presents:
All POLYRACK solutions are characterized by the appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the target market.
POLYRACK at the MtoM & Objets Connectés - Embedded Systems: Hall 5.3, Booth F26 Case and system applications for individual requirements
Straubenhardt, February 9th, 2018 - The POLYRACK TECH-GROUP will be presenting at the MtoM & Objets Connectés - Embedded Systems (March 21-22, 2018 in Paris) in hall 5.3, booth F26 their wide range of case and system solutions for embedded systems. Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the embedded market, particularly for industrial environments, POLYRACK presents its PanelPC 2-series. These Panel-PC-solutions satisfy the protection class IP54 and are available in sizes from 10.1'' to 21.5'' as well as in different materials such as milled aluminum or sheet metal bending solutions. Resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses are options for the user interface. Customer specific printing and anti-fingerprint coating are available on request. In order to use the advantages of different materials, other technologies are available for customers to realize individual requirements in materials, such as plastics and castings - also in a material combination mix.
Small Form Factor with EmbedTEC: The aluminum table top case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminum cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automation and IoT.
The heavy-duty system platform Rugged MIL ½ Short ATR Chassis has been especially developed for rough environments. Available as dip-brazed aluminum or as an alternative sheet metal bending solution according to ARINC 404A, it protects electronic components against mechanical, climatic, chemical and electrical influences. The platform is passively cooled and satisfies the specification standards MIL- 810 and ARINC 404A. POLYRACK also offers applications with active and hybrid (passive and active) cooling as well as liquid cooling. The ATR Chassis can be configured as a complete system with backplanes according to the standards VITA- (VMEbus, VME64x, VPX, OpenVPX) or PICMG (CPCI, CPCI Serial, CPCI Plus I/O), power supply units and I/O-connection boards.
POLYRACK will be presenting additional highlights such as:
All POLYRACK solutions are characterized by suitable interaction of mechanics, plastics, electronics and surface finish - adapted to the target market.
POLYRACK au salon MtoM & Objets Connectés - Embedded Systems: hall 5.3, stand F26 Coffrets et systèmes intégrés pour des besoins individuels et personnalisés.
Straubenhardt, 9 Février 2018 - POLYRACK TECH-GROUP will be presenting its wide range of cases for embedded systems at the MtoM & Objets Connectés - Embedded Systems trade fair (21-22 March 2018 in Paris) in hall 5.3, stand F26. The company has a very strong dominance in personalized solutions and on measure, up to the possibility of realizing a pre-integration of electronics or the conception of IHM / M2M peuvant être utilisé dans différents domains.
In the field of embarqued systems, especially for industrial environments, POLYRACK offers the PanelPC 2 series, for example, which is available with IP54 protection and in dimensions ranging from 10.1" to 21.5". Différentes variantes de matériaux existent, de l'aluminum usiné à une solution en tôlerie pliée. Des écrans single-touch ou multi-touch capacitifs (PCAP) sont disponibles dans différentes épaisseurs de verre. Un marquage par sérigraphie, ou un revêtement résistant aux traces de doigts font présent des nombreuses possibilités de modifications. Pour les cahiers des charges individuels POLYRACK utilisera un large choix de solutions, par exemple dans la sélection des matériaux, pouvant opter différentes matières premières, de l'injection plastiques à la fonderie sous pression voir même une combinaison de technologies et matériaux.
Small Form Factor pour EmbedTEC: Un habillage en aluminium est la solution la plus élégante pour l'habillage des coffrets de petites tailles comme embedded NUC (eNUC), pico-ITX (pITX, 2,5"), SMARC, QSeven et SBCs ou encore Raspberry Pi. Cette nouvelle version reçoit un I/O-Shield interchangeable en face avant, ainsi qu'un capot supérieur en aluminium pour améliorer la dissipation thermique. Pour être compatible avec des produits d'une puissance de fonctionnement plus élevée, le capot supérieur peut facilement être remplacé par un dissipateur thermique, des flancs latéraux perforés et l'intégration de ventilateurs peuvent également permettre d'apporter une solution d'optimisation du flux d'air. Pour des applications d'automatisation et d'IoT POLYRACK offre également diverses adaptations et options de montage.
La plateforme du coffret très robust Rugged MIL ½ Short ATR Châssis est conçue spécialement pour des environnements sévères. Disponible en différentes constructions, en aluminium soudée par brasage ou en version tôlerie pliée selon les standards ARINC 404A, elle protège les composants électroniques contre les influences mécaniques, climatiques, chimiques et électriques. La plateforme est doté d'un refroidissement passif et correspond aux spécifications MIL-standard 810 et ARINC 404A. Avec différents formats de fonds de panier selon VITA- (VMEbus, VME64x, VPX, OpenVPX) ou PICMG-standard (CPCI, CPCI Serial, CPCI Plus I/O), des alimentations et des cartes d'interfaces I/O, ce châssis ATR peut être configuré à plusieurs degrés d'intégrations.
POLYRACK présentera l'ensemble de ces solutions dont entre autres :
Toutes les solutions de POLYRACK se caractérisent par l'interaction entre la fabrication mécanique, de l'injection plastiques, de l'électronique et du traitement de surface - adaptées aux marchés ciblés.
At embedded world (27.2.-1.3.2018 in Nuremberg), POLYRACK TECH-GROUP will be presenting customer-specific system applications from various industries and areas of use, including electronics integration and a selection of HMI and MMI applications, in addition to a wide range of enclosure systems in Hall 3, Stand 557.
You can view the NEWSflyer here.
At the embedded world (February 27th to March 1st in Nuremberg), the POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions in Hall 3, Booth 557. Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
At the embedded world (February 27th to March 1st in Nuremberg), the POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions in Hall 3, Booth 557. Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
POLYRACK at embedded world 2018: Housing and system applications for individual requirements
Straubenhardt, 8 December 2017 - From 27 February to 1 March 2018 at embedded world in Nuremberg (Hall 3, Stand 557), POLYRACK TECH-GROUP will be presenting a wide range of enclosure systems as well as customer-specific system applications from various industries and areas of use, including electronics integration and a selection of HMI and MMI applications.
For the embedded sector, especially for industrial environments, POLYRACK presents the PanelPC 2 series. These panel PC solutions of protection class IP54 are available in sizes from 10.1'' to 21.5'' as well as in different material variants from milled aluminum to sheet metal bending solutions. Resistive single-touch or multi-touch capable capacitive touchscreens (PCAP) in different glass thicknesses are available as user interfaces. Custom printing and anti-fingerprint coatings are available upon request. To take advantage of different materials, customers can also choose from other technologies for material selection to realize individual requirements, such as plastic and cast iron - also in material combinations.
Small Form Factor with EmbedTEC: The aluminum desktop case is the elegant package for small form factors like embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs like the Raspberry Pi. It features a replaceable I/O shield and a solid aluminum lid for heat dissipation. For higher performance, this can be replaced with a heatsink, and perforated side panels and fans further increase cooling performance if required. For applications in the field of automation and IoT, POLYRACK also offers a wide range of adaptations and mounting options.
Other enclosure series such as SmarTECforhigh-quality systems such as passively cooled mini-PCs, EmbedTEC for embedded computing and HMI applications, and backplanes for the high-speed sector with the VPX and CompactPCI Serial standards complete the portfolio of the enclosure specialist POLYRACK. All solutions are characterized by the appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the target market.
POLYRACK at the embedded world 2018: Case and System applications for individual requirements
Straubenhardt (Germany), January 8, 2018 - The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from February 27th to March 1st 2018 at the embedded world in Nuremberg (Hall 3, Booth 557). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the embedded market, particularly for industrial environments, POLYRACK presents its PanelPC 2-series. These Panel-PC-solutions satisfy the protection class IP54 and are available in sizes from 10.1'' to 21.5'' as well as in different materials such as milled aluminum or sheet metal bending solutions. Resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses are options for the user interface. Customer specific printing and anti-fingerprint coating are available on request. In order to use the advantages of different materials, other technologies are available for customers to realize individual requirements in materials, such as plastics and castings - also in a material combination mix.
Small Form Factor with EmbedTEC: The aluminum table top case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminum cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automation and IoT.
Supporting enclosure series like SmarTEC for high quality systems such as passive cooled Mini-PCs, EmbedTEC for Embedded Computing and HMI-applications as well as Backplanes for the high-speed domain based on VPX and CompactPCI serial standards are complementary to the product portfolio of the electronic packaging specialist POLYRACK. All solutions are characterized by matching interaction of mechanics, plastics, electronics and surface finish - fine-tuned to the target market.
POLYRACK at the embedded world 2018: Case and System applications for individual requirements
Straubenhardt (Germany), January 8, 2018 - The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from February 27th to March 1st 2018 at the embedded world in Nuremberg (Hall 3, Booth 557). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the embedded market, particularly for industrial environments, POLYRACK presents its PanelPC 2-series. These Panel-PC-solutions satisfy the protection class IP54 and are available in sizes from 10.1'' to 21.5'' as well as in different materials such as milled aluminum or sheet metal bending solutions. Resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses are options for the user interface. Customer specific printing and anti-fingerprint coating are available on request. In order to use the advantages of different materials, other technologies are available for customers to realize individual requirements in materials, such as plastics and castings - also in a material combination mix.
Small Form Factor with EmbedTEC: The aluminum table top case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminum cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automation and IoT.
Supporting enclosure series like SmarTEC for high quality systems such as passive cooled Mini-PCs, EmbedTEC for Embedded Computing and HMI-applications as well as Backplanes for the high-speed domain based on VPX and CompactPCI serial standards are complementary to the product portfolio of the electronic packaging specialist POLYRACK. All solutions are characterized by matching interaction of mechanics, plastics, electronics and surface finish - fine-tuned to the target market.
