At MedtecLIVE (May 21-23, 2019, Nuremberg), POLYRACK TECH-GROUP will be presenting a wide range of enclosure systems, assemblies and individual parts for many areas of application in medical technology in Hall 9, Stand 416.
You can view the press release as PDF here!
At the MedtecLIVE (21 - 23 May 2019 in Nuremberg) the POLYRACK TECH-GROUP will be presenting their wide range of enclosure systems, assemblies and individual parts for applications in medical technology. Visit us in hall 9, booth 416!
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Thank you for visiting our booth at the embedded world trade fair in Nuremberg.
Through the presentation of various product applications from a wide range of materials and technologies, you were able to gain an impression of our capabilities.
Subscribe now to the POLYRACK newsletter to be always informed about news around "Electronic Packaging"!
Thank you for your visit at our booth at the embedded world in Nuremberg, Germany.
Through the presentation of different product applications and a mix of materials and technologies you have achieved an impression about POLYRACK's capabilities.
Please subscribe the POLYRACK-Newsletter to be informed about the latest news in the field of "Electronic Packaging".
Thank you for your visit at our booth at the embedded world in Nuremberg, Germany.
Through the presentation of different product applications and a mix of materials and technologies you have achieved an impression about POLYRACK's capabilities.
Please subscribe the POLYRACK-Newsletter to be informed about the latest news in the field of "Electronic Packaging".
Housing and system applications for individual requirements
Straubenhardt, 12 December 2018 - From 26 February to 28 February 2019 at embedded world in Nuremberg (Hall 3, Stand 349), POLYRACK TECH-GROUP will be presenting a wide range of enclosure systems as well as customer-specific system applications from various industries and areas of use, including electronics integration and a selection of HMI and MMI applications.
For the embedded sector, especially for industrial environments, POLYRACK presents the PanelPC 2 series. These panel PC solutions of protection class IP54 are available in sizes from 10.1'' to 21.5'' as well as in different material variants from milled aluminum to sheet metal bending solutions. Resistive single-touch or multi-touch capable capacitive touchscreens (PCAP) in different glass thicknesses are available as user interfaces. Custom printing and anti-fingerprint coatings are available upon request. To take advantage of different materials, customers can also choose from other technologies for material selection to realize individual requirements, such as plastic and cast iron - also in material combinations.
Small Form Factor with EmbedTEC: The aluminum desktop case is the elegant package for small form factors like embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs like the Raspberry Pi. It features a replaceable I/O shield and a solid aluminum lid for heat dissipation. For higher performance, this can be replaced with a heatsink, and perforated side panels and fans further increase cooling performance if required. For applications in the field of automation and IoT, POLYRACK also offers a wide range of adaptations and mounting options.
Other enclosure series such as SmarTEC for high-quality systems such as passively cooled mini PCs, EmbedTEC for embedded computing and HMI applications, and backplanes for the high-speed sector with the VPX and CompactPCI Serial standards complete the portfolio of the enclosure specialist POLYRACK. All solutions are characterized by the appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the target market.
Case and System applications for individual requirements
Straubenhardt (Germany), December 12, 2018 - The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from February 27th to February 28th 2019 at the embedded world in Nuremberg (Hall 3, Booth 349). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the embedded market, particularly for industrial environments, POLYRACK presents its PanelPC 2-series. These Panel-PC-solutions satisfy the protection class IP54 and are available in sizes from 10.1'' to 21.5'' as well as in different materials such as milled aluminum or sheet metal bending solutions. Resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses are options for the user interface. Customer specific printing and anti-fingerprint coating are available on request. In order to use the advantages of different materials, other technologies are available for customers to realize individual requirements in materials, such as plastics and castings - also in a material combination mix.
Small Form Factor with EmbedTEC: The aluminum table top case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminum cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automation and IoT.
Supporting enclosure series like SmarTEC for high quality systems such as passive cooled Mini-PCs, EmbedTEC for Embedded Computing and HMI-applications as well as Backplanes for the high-speed domain based on VPX and CompactPCI serial standards are complementary to the product portfolio of the electronic packaging specialist POLYRACK. All solutions are characterized by matching interaction of mechanics, plastics, electronics and surface finish - fine-tuned to the target market.
Case and System applications for individual requirements
Straubenhardt (Germany), December 12, 2018 - The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from February 27th to February 28th 2019 at the embedded world in Nuremberg (Hall 3, Booth 349). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the embedded market, particularly for industrial environments, POLYRACK presents its PanelPC 2-series. These Panel-PC-solutions satisfy the protection class IP54 and are available in sizes from 10.1'' to 21.5'' as well as in different materials such as milled aluminum or sheet metal bending solutions. Resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses are options for the user interface. Customer specific printing and anti-fingerprint coating are available on request. In order to use the advantages of different materials, other technologies are available for customers to realize individual requirements in materials, such as plastics and castings - also in a material combination mix.
Small Form Factor with EmbedTEC: The aluminum table top case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminum cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automation and IoT.
Supporting enclosure series like SmarTEC for high quality systems such as passive cooled Mini-PCs, EmbedTEC for Embedded Computing and HMI-applications as well as Backplanes for the high-speed domain based on VPX and CompactPCI serial standards are complementary to the product portfolio of the electronic packaging specialist POLYRACK. All solutions are characterized by matching interaction of mechanics, plastics, electronics and surface finish - fine-tuned to the target market.
Again POLYRACK was able to impress with a strong presence at electronica - join us on a tour here!
POLYRACK once again showed strong presence at the electronica - click here for a tour with us!
POLYRACK once again showed strong presence at the electronica - click here for a tour with us!
Straubenhardt, October 9, 2018 - The POLYRACK Electronic-Aufbausysteme GmbH has recently acquired the DIN EN 45545 classification for card guides and thus fulfills all technical requirements in the field of fire protection according to DIN EN 45545-2:2016-02.
The DIN regulates the fire protection of all products that are used in rail vehicles and have a possible fire protection potential.
The card guidance product is mainly used in rail applications and is subject to certain fire protection guidelines for rail vehicles in passenger traffic. The fire protection regulations specify the requirements for the fire behavior of the materials and components installed in the vehicle in order to guarantee sufficient protection for persons in emergency situations and to enable effective evacuation and rescue. POLYRACK achieved a classification result of the card guidance according to requirement set R24 for the hazard level HL3 which is the highest classification according to the hazard level table in order to give designers of the vehicle manufacturers a maximum of planning reliability. With the DIN EN 45545-2 classification, POLYRACK guarantees its customers safe and high-quality card guides for rail vehicles.
Straubenhardt, 08 October 2018 - POLYRACK Electronic-Aufbausysteme GmbH has received the classification according to DIN EN 45545 for their card guides and fulfils the requirements for fire protection of materials and components on railway vehicles.
The DIN EN standard regulates the fire protection of all products that are used in rail vehicles which have a potential for fire protection.
The card guides are common in railway applications and are subject to certain fire protection guidelines for passenger rail vehicles. The fire protection regulation specifies the requirements of fire performance for materials and components which are installed in the vehicle to allow an effective evacuation and rescue of persons in case of emergencies. POLYRACK achieved a classification result according to the requirement set R24 for the hazard level HL3. This is the highest possible classification stated in the hazard level table and provides construction engineers of railway vehicles a maximum of planning certainty.
POLYRACK guarantees its customers safe and high-grade card guides for rail vehicles according to DIN EN 45545-2.
Straubenhardt, 08. Octobre 2018 - POLYRACK Electronic-Aufbausysteme GmbH a récemment obtenu la qualification de ses guide-cartes selon la norme DIN EN 45545-2:2016-02 et satisfait ainsi toutes les exigences techniques du domaine de la protection contre les incendies dans les véhicules ferroviaires.
The standard DIN EN 45545-2 regulates the requirements for the fire resistance of the materials and components used in ferrovia vehicles.
Le produit guide-cartes est principalement utilisé dans les applications ferroviaires et soumis aux directives de protection contre les incendies dans les véhicules ferroviaires pour le transport des voyageurs. The réglementation en matière de protection contre les incendies définit les exigences du comportement au fie des matériaux et des composants utilisés dans les véhicules ferroviaires, dans le but de garantir une protection suffisante des personnes en cas de situation d'urgence et afin de permettre une évacuation et un sauvetage efficaces. POLYRACK has obtained a classification of its guide-cartes according to the exigencies R24 for a level of danger HL3, which is the level of classification the highest possible; the aim is to give the designers and constructors of rolling stock the highest possible level of certitude.
Avec la qualification DIN EN 45545-2, POLYRACK garantit à ses clients du domaine ferroviaire, des guide-cartes sûrs et de haute qualité.
Thank you for visiting our booth at the electronica trade fair in Munich.
Through the presentation of various product applications from a wide range of materials and technologies, you were able to gain an impression of our capabilities.
We would like to thank you very much for your interest in our products and the friendly conversation.
Subscribe now to the POLYRACK newsletter to be always informed about news around "Electronics Packaging"!
Thank you for your visit at our booth at the electronica - the world's leading trade fair for Electronic Components, Systems and Applications in Munich, Germany.
Through the presentation of different product applications and a mix of materials and technologies you have achieved an impression about POLYRACK's capabilities. We would like to thank you for your interest in our products and the friendly conversation which we would like to continue in the near future.
Please subscribe the POLYRACK-Newsletter to be informed about the latest news in the field of "Electronic Packaging".
Thank you for your visit at our booth at the electronica - the world's leading trade fair for Electronic Components, Systems and Applications in Munich, Germany.
Through the presentation of different product applications and a mix of materials and technologies you have achieved an impression about POLYRACK's capabilities. We would like to thank you for your interest in our products and the friendly conversation which we would like to continue in the near future.
Please subscribe the POLYRACK-Newsletter to be informed about the latest news in the field of "Electronic Packaging".
