News around POLYRACK

Straubenhardt, April 13, 2016 - POLYRACK TECH-GROUP now offers a versatile enclosure solution for the eNUC form factor. It is based on the modular EmbedTEC series.

The EmbedTEC enclosure solution for the eNUC (embedded Next Unit of Computing) form factor consists of a visually appealing aluminum desktop enclosure (134 x 112 x 45mm). This features a front-mounted, replaceable I/O shield and a solid aluminum lid for heat dissipation. For higher performance, the lid can be replaced with a heatsink, alternatively perforated side panels or small fans can be used for higher cooling performance. The new eNUC enclosure solution from the EmbedTEC family can be used as a desktop enclosure as well as mounted via adapter to a wall, Vesa mount or in different orientation to a DIN rail.

Straubenhardt, February 18, 2016 - Within the new 3D download area, POLYRACK now offers its customers the possibility to download CAD data of all products directly from the homepage. This simplifies the implementation of projects and shortens the development time.

On its website, the enclosure specialist POLYRACK now offers free access to the CAD data of its products. In the new 3D download area, all models for the CAD design software SolidWorks are available. With the help of a free article search, the desired series can be found quickly and downloaded free of charge in 2D or 3D in various formats (IGES, DXF, STEP, etc.). This allows customers to integrate their selected housing or housing part directly into their design and use it for documentation purposes. In this way, POLYRACK supports its customers in significantly shortening their planning and coordination phase with the manufacturer and end customer. The download area is freely accessible after registration on the POLYRACK homepage. See: Download portal

Individual system applications for different fields of application

Straubenhardt, December 11, 2015 - POLYRACK TECHGROUP will present its wide range of innovative housing and system solutions as well as panel PCs for HMI / MMI applications at embedded world 2016 (Feb. 23-25, Nuremberg) in Hall 5, Booth 180.

In addition to a wide range of application-specific system solutions, a highlight at the booth is the SmarTEC case series expanded as a passively cooled x86 mini PC. Thanks to variable expandability, it enables the realization of high-quality systems, combining accessibility from above with the advantages of a profile solution, such as stability and design optimized for assembly times. POLYRACK will also present various solutions for single board computing (SBC) based on the Raspberry Pi, Arduino, Odroid and Beagle Bone platforms.

The PanelPC 2 series is particularly suitable for industrial applications, also in the extended temperature range (-20°C to +85°C). The housing is available in "milled aluminum" and as a sheet metal bending solution in sizes from 10.1" to 21.5" up to protection class IP54 (IP68 in preparation). The multi-touch capable PCAP touchscreen can optionally be equipped with tempered glasses and/or anti-fingerprint coating.

A new product at the booth is the heavy-duty Rugged MIL ½ Short ATR Chassis according to ARINC 404A as a sheet metal bending variant. It offers electronic components protection against mechanical, climatic, chemical and electrical influences. With various backplanes according to VITA (VMEbus, VME64x, VPX, OpenVPX) or PICMG standard (CPCI, CPCI Serial, CPCI Plus I/O), power supplies and I/O connection cards, it can be configured to form a complete system.

POLYRACK presents housing and system solutions for specific applications

Straubenhardt, September 14, 2015 - POLYRACK TECH-GROUP will be presenting its wide range of individual housing and system solutions as well as panel PCs for HMI/MMI applications at SPS IPC Drives from November 24-26, 2015 (Hall 5, Stand 451).

POLYRACK's extensive product range includes both standard series and customer-specific solutions, ranging from integrated slide-in and desktop enclosures to panel PCs and backplanes to microcomputer surface-mount systems (MPS). Here, users will find the right individual solution for every area of application.

The Rugged MIL ½ Short ATR system is designed for harsh environments. The salt-bath soldered chassis meets the requirements of security and defense technology and offers electronic components comprehensive protection against mechanical, climatic, chemical and electrical influences. Thanks to passive "conductive cooling", heat loss is effectively dissipated from the components. The standard model is available in 13 sizes and variants according to the ARINC 404A standard, and the system can also be configured with CPCI, VME, VME-64X and VPX backplanes, as well as power supplies and I/O connection cards.

For the embedded sector, especially for industrial environments, POLYRACK presents the PanelPC 2 series. These panel PC solutions of protection class IP54 from 10.1'' to 21.5'' are available in different material variants from milled aluminum to sheet metal bending solutions. Resistive single-touch or multi-touch capacitive touchscreens (PCAP) in different glass thicknesses are available as user interfaces. Customized printing and anti-fingerprint coatings are available on request.

Further enclosure series such as SmarTEC for high-quality systems like passively cooled mini PCs, EmbedTEC for embedded computing and HMI applications as well as backplanes for the high-speed range with the VPX and CompactPCI Serial standards complete the portfolio of the enclosure specialist POLYRACK.

Straubenhardt, August 26, 2015 - RAPP Kunststofftechnik, specialist for plastics within the POLYRACK TECHGROUP, has invested significantly in the expansion of its machinery. With a new 13,000kN injection molding machine, the company is expanding its existing portfolio of products and services for plastic parts weighing up to approx. 6,000g.

With the new 13,000kN (1,300t) injection molding machine at the Ettlingen plant, RAPP Kunststofftechnik is now able to produce parts with dimensions of up to one meter and weights of up to approx. 6 kilograms. This opens up new opportunities for all companies in the POLYRACK TECH-GROUP network to expand their product range and consistently align it to the constantly growing requirements of their markets and customers. Starting with development, prototyping and toolmaking, the company pursues the holistic production process of thermoplastic parts, e.g. in the processes of compact injection molding, thermoplastic foam molding (TSG) or multi-component technology (2K, 3K).
RAPP Kunststofftechnik also invested in a new crane system for handling loads of up to 10 tons. Among other things, it allows the heavy and sensitive injection molding tools to be handled professionally. RAPP Kunststofftechnik also integrated a drying system with automatic granulate feed directly to the machines for reliable preparation of the plastic granulates. When selecting the new injection molding machine, including the associated machine peripherals, the company also focused on energy and environmental aspects. In order to achieve and ensure energy-efficient operation, energy consumption is continuously monitored. It was only in 2013 that POLYRACK TECH-GROUP put the plant with the punch laser center in Ettlingen into operation, after the existing machinery had been expanded to include another automated punch nibbling machine (TRUPUNCH 5000) and the TRULASER 5030 Fiber flatbed laser, as well as an automated high-bay warehouse for machine supply. At the same location, the company is now expanding its injection molding capacity by a further 20-30%. In addition, there is space for up to six more injection molding machines in the >400t size range.

Characteristics Injection molding machine:
Negri Bossi, Type V1300-12000
Clamping force: 13,000kN (1,300t)
Clamping dimension: 1,400 x 1,200mm
Maximum part size: approx. 600 x 1,000mm
Maximum part weight: approx. 6,000g

Straubenhardt, February 04, 2015 - The new PanelPC 2 series from POLYRACK is suitable for a wide range of applications with a large number of variants. Equipped with a capacitive touchscreen and expansion options, the PanelPC 2 can withstand even the toughest conditions in industrial environments.

POLYRACK has designed its PanelPC 2 series specifically for HMI/MMI applications in industry. The products can be used in the extended temperature range from -20° to +85°C and also withstand the highest requirements in terms of shock and vibration. Thanks to IP65, the housings are reliably protected against the ingress of dust and water.

Customers can choose between different designs and variants: Display sizes up to 23" are possible. In terms of housing construction, customers can choose between the "milled aluminum" variant and the sheet metal bending solution based on the "EmbedTEC" housing system as well as in stainless steel frame construction, an extremely variable housing series for embedded computing and HMI from POLYRACK. The user interface of the PanelPC 2 series consists of a multi-touch capable capacitive touchscreen (PCAP), a resistive touchscreen is also available on request. For industrial applications, POLYRACK offers specially hardened glasses and anti-fingerprint coatings as optional additional equipment. As standard, the products are rear-mounted according to VESA 75/100, and their ventilation is passive. The PanelPC 2 series thus fulfills all functional requirements in the technical application area, including intuitive operation, as well as the visual demands of a modern design.