News around POLYRACK

POLYRACK presents housing and system solutions for demanding applications

Straubenhardt, October 5, 2017 - POLYRACK TECH-GROUP offers high-quality system solutions with the economic benefits of series production and will be presenting HMI/MMI applications at SPS IPC Drives from November 28-30, 2017 (Hall 5, Stand 171). ‍

For the embedded sector, especially for industrial environments, POLYRACK presents the PanelPC 2 series. These panel PC solutions of protection class IP54 are available in sizes from 10.1'' to 21.5'' as well as in different material variants from milled aluminum to sheet metal bending solutions. Resistive single-touch or multi-touch capable capacitive touchscreens (PCAP) in different glass thicknesses are available as user interfaces. Custom printing and anti-fingerprint coatings are available upon request. ‍

Small Form Factor with EmbedTEC: The aluminum desktop case is the elegant package for small form factors like embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs like the Raspberry Pi. It features a replaceable I/O shield and a solid aluminum lid for heat dissipation. For higher performance, this can be replaced with a heatsink, and perforated side panels and fans further increase cooling performance if required. For applications in the field of automation and IoT, POLYRACK also offers a wide range of adaptations and mounting options.

Other enclosure series such as SmarTEC for high-quality systems such as passively cooled mini PCs, EmbedTEC for embedded computing and HMI applications, and backplanes for the high-speed sector with the VPX and CompactPCI Serial standards complete the portfolio of the enclosure specialist POLYRACK. All solutions are characterized by the perfect interplay of mechanics, plastics technology and electronics - precisely tailored to the target market.

12 young people started their careers with a welcome day on 01.09.2017. In addition to two process mechanics, two metal technology specialists, five tool mechanics, one technical product designer and two industrial clerks, we are also delighted to welcome two dual university students for the Mechanical Engineering and International Business courses at the beginning of October this year. There are currently 31 trainees at POLYRACK TECH-GROUP . The five training managers will do their best to ensure that the young people quickly find their feet in their respective areas of work and network well with their fellow trainees and colleagues. We attach great importance to training our own specialists. In a family-oriented company, our trainees learn everything they need for their future careers.

The modular open frame test and development platform can be used in VME/64x and VPX based embedded applications. The development system in rugged aluminum design can accommodate 3U backplanes with up to 10 slots in 1.0 as well as 0.8 inch pitch. The platform supports any combination of front and rear convection or conduction cooled 3U boards.

The system allows application engineers and system designers to access the plug-in cards and backplane from all sides. Efficient cooling is provided by four high-performance 120 CFM fans mounted under the card cage. The black powder-coated enclosure features an IEC power input module with filter, power switch and fuses on the rear. A separate ground connection is also provided. A modular power supply concept with a wide power spectrum completes this platform.

Optionally, additional side plates and the cover plate can be mounted to meet EMC requirements.

The platform also offers RTM (rear transmission module) support.

At Railtex 2017, the 13th international trade fair for railroad equipment, systems and services from May 9 to 11 in Birmingham, POLYRACK TECH-GROUP will be presenting itself as a cross-technology partner for standard and customized enclosure and system solutions for a wide range of markets.

We are looking forward to your visit at booth A69!

We were very pleased to welcome you at our booth and to present you our novelties.

embedded world in Nuremberg impressively underpins its role as the leading international trade fair.

With its 15th edition, embedded world once again impressively confirms that it is THE international meeting place for the embedded systems technology industry. In 2017, it again made substantial gains in the important exhibition-relevant key figures and ends with new records after three exciting and intensive exhibition and congress days: More than 30,000* trade visitors - the international share has increased to 38% - came to Nuremberg, and with more than 1,000 exhibitors (+8%) from 40 countries, the event set a new highlight.

Enclosure and system solutions for demanding markets Straubenhardt, December 20, 2016 - POLYRACK TECH-GROUP will be presenting itself at embedded world 2017 (14-16 March 2017 in Nuremberg) in Hall 3A, Stand 338 as a cross-technology partner for standard and customer-specific enclosure and system solutions for many markets.

Designed for harsh environments, the Rugged MIL ½ Short ATR Chassis is a heavy-duty enclosure platform. Available as a salt-brazed aluminum construction and as a sheet metal bending solution according to ARINC 404A, it protects electronic components from mechanical, climatic, chemical and electrical influences. With backplanes according to VITA (VMEbus, VME64x, VPX, OpenVPX) or PICMG standard (CPCI, CPCI Serial, CPCI Plus I/O), power supplies and I/O connection cards, the ATR chassis can be configured to form a complete system. The modular VPX 19" development chassis for use in VME/64x and VPX based embedded applications allows access from all sides for convenient testing and debugging. The rugged aluminum construction accommodates three U backplanes with up to ten slots in 1.0 and 0.8 inch pitch. It also meets high mechanical requirements, e.g. in aerospace, railroad, marine and industrial applications