Straubenhardt, January 30, 2020 - At MtoM & Objets Connectés - Embedded Systems (March 18-19, 2020 in Paris) in Hall 5.3, Stand D17, POLYRACK TECH-GROUP will be presenting a wide range of enclosure systems as well as customer-specific system applications from various industries and areas of use, including electronics integration and a selection of HMI and MMI applications.
For the embedded sector, especially for industrial environments, POLYRACK presents the PanelPC 2 series. These panel PC solutions of protection class IP54 are available in sizes from 10.1'' to 21.5'' as well as in different material variants from milled aluminum to sheet metal bending solutions. Resistive single-touch or multi-touch capable capacitive touchscreens (PCAP) in different glass thicknesses are available as user interfaces. Custom printing and anti-fingerprint coatings are available upon request. To take advantage of different materials, customers can also choose from other technologies for material selection to realize individual requirements, such as plastic and cast iron - also in material combinations.
Small Form Factor with EmbedTEC: The aluminum desktop case is the elegant package for small form factors like embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs like the Raspberry Pi. It features a replaceable I/O shield and a solid aluminum lid for heat dissipation. For higher performance, this can be replaced with a heatsink, and perforated side panels and fans further increase cooling performance if required. For applications in the field of automation and IoT, POLYRACK also offers a wide range of adaptations and mounting options.
The 19" mounting system MPS03, which is available in different sizes (e.g. 1U, 2 slot) is ideal for the field of communication technology.
For the accommodation of Eurocards and PCBs with a height of 100 or 122mm, but also for the use of customer-specific electronic components, POLYRACK presents the RAILO mounting rail / wall module. Further enclosure series such as SmarTEC for high-quality systems such as passively cooled mini PCs, EmbedTEC for embedded computing and HMI applications as well as backplanes for the high-speed range with the VPX and CompactPCI Serial standards complete the portfolio of the enclosure specialist POLYRACK. All solutions are characterized by the appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the target market.
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Straubenhardt, January 30, 2020 - POLYRACK TECH-GROUP will be exhibiting at the MtoM & Objets Connectés - Embedded Systems trade fair (18-19 March 2020 in Paris) in pavilion 5.3, stand D17, its wide range of cases, boxes, racks, for embedded systems and more particularly its solutions on measurement and personalization, all up to the possibility of realizing a pre-embedding of electronics or the conception of IHM / M2M usable in different domains.
In the field of embarqued systems, especially for industrial environments, POLYRACK offers the PanelPC 2 series, for example, which is available with IP54 protection and in dimensions ranging from 10.1" to 21.5". Des écrans single-touch ou multi-touch capacitifs (PCAP) sont disponibles dans différentes épaisseurs de verre. Un marquage par sérigraphie, ou un revêtement résistant aux traces de doigts font partie des nombreuses possibilités de modifications. Pour les cahiers des charges client, POLYRACK utilisera un large choix de solutions, par exemple dans la sélection des matériaux, pouvant opter différentes matières premières et différents process tel que l'injection plastique, la fonderie sous pression, l'usinage, la tôlerie, voire même une combinaison de technologies et matériaux.
Small Form Factor pour EmbedTEC: Un habillage en aluminium est la solution la plus élégante pour l'habillage des coffrets de petites tailles comme embedded NUC (eNUC), pico-ITX (pITX, 2,5"), SMARC, QSeven et SBCs ou encore Raspberry Pi. Cette nouvelle version reçoit un I/O-Shield interchangeable en face avant, ainsi qu'un capot supérieur en aluminium pour améliorer la dissipation thermique. Pour être compatible avec des produits d'une puissance de fonctionnement plus élevée, le capot supérieur peut facilement être remplacé par un dissipateur thermique, des flancs latéraux perforés et l'intégration de ventilateurs peuvent également permettre d'apporter une solution d'optimisation du flux d'air. Pour la sécurité des systèmes électroniques dans le domaine des systèmes embarqués et d'IoT POLYRACK offre également diverses adaptations et options de montage.
Le système 19" Compact PCI MPS03 disponible en différentes tailles (par ex. 1U 2-Slot) est idéal pour les technologies de communication.
Pour la réception de cartes Europe ou de circuits imprimés d'une hauteur de 100 ou 122mm, mais également pour l'utilisation de composants électroniques personnalisés, POLYRACK présentera le module à support Rail-Din ou en fixation murale RAILO. D'autres séries de coffrets comme SmarTEC pour les systèmes de haute qualité tels que les mini-PC à refroidissement passif, EmbedTEC pour Embedded Computing et les applications IHM, ainsi que des fonds de panier avec des vitesse de transfert des signaux élevés selon les standards VPX et Compact PCI Serial complètent le portefolio du spécialiste de l'habillage électronique, POLYRACK. All POLYRACK solutions are characterized by the interaction between mechanical fabrication, plastic injection, electronics and surface treatment - adapted to the markets and the requirements of each project.
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Straubenhardt, 12 December 2019 - From 25 to 27 February 2020 at embedded world in Nuremberg (Hall 3, Stand 445), POLYRACK TECH-GROUP will be presenting a wide range of enclosure systems as well as customer-specific system applications from various industries and areas of use, including electronics integration and a selection of HMI and MMI applications.
POLYRACK presents the PanelPC 2 series for the embedded sector, especially for industrial environments. With protection class IP54, it is available in sizes from 10.1'' to 21.5'' and in different material variants. Resistive single-touch or multi-touch capable capacitive touchscreens (PCAP) in several glass thicknesses are available as user interfaces. Customized printing and anti-fingerprint coatings are available on request. In addition, other materials are available to customers for the realization of individual requirements, e.g. plastic and cast iron - also in material combinations.
Small Form Factor with EmbedTEC: The aluminum desktop enclosure is the elegant and secure application for small form factors like embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs like the Raspberry Pi. It features a replaceable I/O shield and a solid aluminum lid for heat dissipation. For higher performance, this can be replaced with a heatsink, and perforated side panels and fans further increase cooling performance if required. POLYRACK also offers a wide range of customization and mounting options for the security of electronic systems in the embedded sector and IoT.
The 19" Compact PCI system MPS03 in various sizes (e.g. 1U 2-slot) is ideally suited for communication technology, among others. POLYRACK shows the RAILO mounting rail / wall module for the accommodation of single Eurocards or PCBs with 122mm height as well as for the expansion with individual electronics. Further enclosure series such as SmarTEC for high-quality systems such as passively cooled mini PCs, EmbedTEC for embedded computing and HMI applications as well as backplanes for the high-speed range with the VPX and CompactPCI Serial standards complete the portfolio of the enclosure specialist POLYRACK. All solutions are characterized by the appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the requirements of the customer application.
Update (20.02.2020): POLYRACK TECH-GROUP cancels its participation in embedded world 2020. "We have been monitoring the situation closely and have decided to take this step after many companies in the industry and customers have already announced that they will not be taking part in embedded world - neither as exhibitors nor as visitors."
Straubenhardt (Germany), December 12th, 2019 - The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from February 25th to 27th 2020 at the embedded world in Nuremberg (Hall 3, Booth 445). In addition to a large number of case systems, particularly customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the embedded sector, especially for industrial environments, POLYRACK presents the PanelPC 2 series. With protection class IP54, it is available in sizes from 10.1'' to 21.5'' and in various material variants. Resistive single-touch or multi-touch capable capacitive touch screens (PCAP) in several glass thicknesses are available as user interfaces. Customized painting and anti-fingerprint coatings are available on request. In addition, other materials are available to customers for the realization of individual requirements, e.g. plastic and cast iron - also in material combinations.
Small Form Factor with EmbedTEC: The aluminum desktop case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminum cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automation and IoT.
The elegant 19" Compact PCI system MPS03 which is available in different sizes (e.g. 1U, slots) is ideally suited for applications in the field of communications technology. POLYRACK will also be showing the RAILO wall-mounting module, which accommodates PCBs, Eurocards or custom electronics with a height of 122 mm. Further case series like the SmarTEC for systems like the passive cooled Mini PCs, EmbedTEC for embedded computing and HMI applications as well as Backplanes for the High-Speed-Area with Standard VPX and CompactPCI Serial complete the portfolio of POLYRACK.
All solutions are characterized by the appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the requirements of the customer application.
Update (20.02.2020): The POLYRACK TECH-GROUP cancels its participation at embedded world 2020, "we have been monitoring the situation closely and decided to take this step after many companies and customers in the industry have already announced that they will not be taking part in embedded world - either as exhibitors or as visitors".
Straubenhardt (Germany), December 12th, 2019 - The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from February 25th to 27th 2020 at the embedded world in Nuremberg (Hall 3, Booth 445). In addition to a large number of case systems, particularly customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the embedded sector, especially for industrial environments, POLYRACK presents the PanelPC 2 series. With protection class IP54, it is available in sizes from 10.1'' to 21.5'' and in various material variants. Resistive single-touch or multi-touch capable capacitive touch screens (PCAP) in several glass thicknesses are available as user interfaces. Customized painting and anti-fingerprint coatings are available on request. In addition, other materials are available to customers for the realization of individual requirements, e.g. plastic and cast iron - also in material combinations.
Small Form Factor with EmbedTEC: The aluminum desktop case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminum cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automation and IoT.
The elegant 19" Compact PCI system MPS03 which is available in different sizes (e.g. 1U, slots) is ideally suited for applications in the field of communications technology. POLYRACK will also be showing the RAILO wall-mounting module, which accommodates PCBs, Eurocards or custom electronics with a height of 122 mm. Further case series like the SmarTEC for systems like the passive cooled Mini PCs, EmbedTEC for embedded computing and HMI applications as well as Backplanes for the High-Speed-Area with Standard VPX and CompactPCI Serial complete the portfolio of POLYRACK.
All solutions are characterized by the appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the requirements of the customer application.
Update (20.02.2020): The POLYRACK TECH-GROUP cancels its participation at embedded world 2020, "we have been monitoring the situation closely and decided to take this step after many companies and customers in the industry have already announced that they will not be taking part in embedded world - either as exhibitors or as visitors".
Thank you for visiting our booth at the SPS trade fair in Nuremberg.
Through the presentation of various product applications from a wide range of materials and technologies, you were able to gain an impression of our capabilities.
Thank you for your visit at our booth at the SPS in Nuremberg, Germany.
Through the presentation of different product applications and a mix of materials and technologies you have achieved an impression about POLYRACK's capabilities.
Thank you for your visit at our booth at the SPS in Nuremberg, Germany.
Through the presentation of different product applications and a mix of materials and technologies you have achieved an impression about POLYRACK's capabilities.
POLYRACK congratulates KTV Straubenhardt to the title in the German Artistic Gymnastics League
In the league final last Saturday in the Ludwigsburg MHP Arena, the Bundesliga team of the KTV Straubenhardt fully achieved the set season goal of bringing the now seventh championship to Straubenhardt with a terrific team performance. In the literal "heartbeat final", the team around coach Steve Woitalla secured the German Team Championship 2019 with a 29:27 against TG Saar and now adds the seventh star to the club logo with the title win.
"I am very proud of our team, whose fighting spirit and team spirit enabled them to successfully complete this difficult season despite bad luck due to injuries," said a delighted Steve Woitalla, sporting director of KTV Straubenhardt. Andreas Rapp, president of the KTV Straubenhardt sponsors' association and managing director of the main sponsor, POLYRACK TECH-GROUP Holding GmbH & Co. KG: "The treble was already a mega experience, but we didn't expect to win the title in this year's final. The boys showed great morale. The team will largely stay together in the coming season. We can once again look forward to top-class gymnastics in Straubenhardt in 2020."
A very big thank you at this point goes to all sponsors, friends and supporters, as well as to the hardworking helpers and supporters, without whom such a performance would not be possible. For the important mental support the gymnasts could rely on their loyal fans as always. Many thanks to them as well.
The Bundesliga squad of KTV Straubenhardt in the 2019 season included: David Belyavskiy, Pascal Brendel, Andreas Bretschneider, Nils Dunkel, Brian Gladow, Lucas Herrmann, Nick Klessing, Alexander Maier, Marcel Nguyen, Tobias Radoi, Ivan Rittschik and Daniel Wörz.
Sorry, there is no translation for this news-article.
Désolé, il n'y a pas de traduction pour cet article
From 26 to 28 November 2019 at SPS in Nuremberg (Hall 3C, Stand 531), POLYRACK TECH-GROUP will be presenting a wide range of enclosure systems as well as customer-specific system applications from various industries and areas of use, including electronics integration and a selection of HMI and MMI applications.
Make a note of this date right away!
You can view the press release here.
The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from November 26th to 28th 2019 at the SPS in Nuremberg (Hall 3C, Booth 531). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
Save the Date and read the complete press release here!
The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from November 26th to 28th 2019 at the SPS in Nuremberg (Hall 3C, Booth 531). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
Save the Date and read the complete press release here!
From 26 to 28 November 2019 at SPS in Nuremberg (Hall 3C, Stand 531), POLYRACK TECH-GROUP will be presenting a wide range of enclosure systems as well as customer-specific system applications from various industries and areas of use, including electronics integration and a selection of HMI and MMI applications.
For control and drive technology, especially for industrial environments, POLYRACK presents the PanelPC 2 series. These panel PC solutions with IP54 protection are available in sizes ranging from 10.1'' to 21.5'' and in different material variants from milled aluminum to sheet metal bending solutions. Resistive single-touch or multi-touch capable capacitive touchscreens (PCAP) in different glass thicknesses are available as user interfaces. For example, operating concepts with gesture control can also be projected for smart production. Customized printing and anti-fingerprint coatings are available on request. In order to exploit the advantages of different materials, customers can also choose from other technologies for the realization of individual requirements, such as plastic and cast iron - also in material combinations.
Small Form Factor with EmbedTEC: The aluminum desktop case is the elegant package for small form factors like embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs like the Raspberry Pi. It features a replaceable I/O shield and a solid aluminum lid for heat dissipation. For higher performance, this can be replaced with a heatsink, and perforated side panels and fans further increase cooling performance if required. For applications in the field of automation and IoT, POLYRACK also offers a wide range of adaptations and mounting options.
Other enclosure series such as SmarTEC for high-quality systems such as passively cooled mini PCs, EmbedTEC for embedded computing and HMI applications, and backplanes for the high-speed sector with the VPX and CompactPCI Serial standards complete the portfolio of the enclosure specialist POLYRACK. All solutions are characterized by the appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the target market.
The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from November 26th to 28th 2019 at the SPS in Nuremberg (Hall 3C, Booth 531). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the control and drive technology, particularly for industrial environments, POLYRACK presents its PanelPC 2-series. These Panel-PC-solutions comply with the protection class IP54 and are available in sizes from 10.1" to 21.5" as well as in different materials such as milled aluminum or sheet metal bending solutions. Resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses are options for the user interface. For example operating concepts with gesture control may be projected for smart production operating as well. Customer specific printing and anti-fingerprint coating are available on request. In order to use the advantages of different materials, other technologies are available for customers to realize individual requirements in materials, such as plastics and cast components - also in a material combination.
Small Form Factor with EmbedTEC: The aluminum desktop case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminum cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automation and IoT.
Supporting enclosure series like SmarTEC for high quality systems such as passive cooled Mini-PCs, EmbedTEC for Embedded Computing and HMI-applications as well as Backplanes for the high-speed domain based on VPX and CompactPCI serial standards are complementary to the product portfolio of the electronic packaging specialist POLYRACK. All solutions are characterized by matching interaction of mechanics, plastics, electronics and surface finish - fine-tuned to the target market.
The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from November 26th to 28th 2019 at the SPS in Nuremberg (Hall 3C, Booth 531). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the control and drive technology, particularly for industrial environments, POLYRACK presents its PanelPC 2-series. These Panel-PC-solutions comply with the protection class IP54 and are available in sizes from 10.1" to 21.5" as well as in different materials such as milled aluminum or sheet metal bending solutions. Resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses are options for the user interface. For example operating concepts with gesture control may be projected for smart production operating as well. Customer specific printing and anti-fingerprint coating are available on request. In order to use the advantages of different materials, other technologies are available for customers to realize individual requirements in materials, such as plastics and cast components - also in a material combination.
Small Form Factor with EmbedTEC: The aluminum desktop case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminum cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automation and IoT.
Supporting enclosure series like SmarTEC for high quality systems such as passive cooled Mini-PCs, EmbedTEC for Embedded Computing and HMI-applications as well as Backplanes for the high-speed domain based on VPX and CompactPCI serial standards are complementary to the product portfolio of the electronic packaging specialist POLYRACK. All solutions are characterized by matching interaction of mechanics, plastics, electronics and surface finish - fine-tuned to the target market.
