CompactPCI

  • PICMG specification 2.0 R3.0 core specification
  • 10 layers multilayer, impedance controlled
  • Available in 3 and 6 U from 1 to 8 slots without bridge slot
  • System slot optionally left or right
  • Available in 32 and 64 bit
  • Suitable for hot swap applications
  • Utility connector for status signals

Customized adaptions are possible 

  • PICMG specification 2.0 R3.0 core specification, 2.1 R2.0 compliant
  • Hot swap specification
  • 2.9 R1.0 system management specification
  • JTAG interface, 33 and 66MHz configurable (up to max. 5 slots)
  • Connector class 2
  • Power connections M4, ATX and HDD connectors

Customized adaptations are possible

  • Basé sur le standard PICMG 2.0 R3.0 Spécification Core
  • 10 couches multicouche, à impédance contrôlée
  • Disponible en 3 et 6 U de 1 au 8 emplacements sans Bridge-Slot
  • Au choix slot système à gauche ou à droite
  • Disponible en 32 et 64 bits
  • Hot swap est possible
  • Connecteur de service pour les signaux d'état

Adaptations propres au client sont possible

CompactPCI Backplanes based on a PICMG standard (PICMG 2.0 Rev.3.0) are intended for industrial applications and environments that demand high standards due to reliability and robustness.<br>For this purpose the classic PCI bus is converted to a 19" compliant platform.

Dimensions

Height

3, 6 U

PC board thickness
  • 3.2 mm
configuration
  • 10 layers multilayer, impedance controlled
Slots
  • max. 8, without bridge slot
  • System slot optionally left or right
Data size
  • 32 and 64 bit
Norms / Standards
  • PICMG-Spezifikation 2.0 R3.0 Core Spezifikation
  • 2.1 R2.0 compliant
  • Hot Swap Specification
  • 2.9 R1.0 System Management Spezifikation
  • JTAG interface, 33 and 66MHz configurable (up to max. 5 slot)
  • Connector class 2
  • Power connections M4, ATX and HDD connectors

Complementary products

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