Blog

POLYRACK TECH-GROUP entwickelt Rugged MIL 1/2 Short ATR Chassis

1 Oct
6 Mar
2014
2024
|
Polyrack Tech-Group

Für den Einsatz in rauen mechanischen, klimatischen, chemischen und elektrischen Umgebungen hat die POLYRACK TECH-GROUP jetzt ein ATR-System (Air Transportation Rack) entwickelt. Das Rugged MIL 1/2 Short ATR CHassis nach ARINC 404A Standard verfügt über fünf 3U Slots mit OpenVPX-Profil. Dieses entspricht den Normen der VITA65 und arbeitet mit deiner Datenübertragungsrate von bis zu 10 GBit/s. Das salzgelötete Gehäuse bietet eine komplett versiegelte Umgebung und unterstützt das passive "conductive cooling", indem es die Wärme effektiv vom Board und dem Netzteil ableitet.

Die komplette Pressemitteilung können Sie
Die komplette Pressemitteilung können Sie
lesen.
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Blog

POLYRACK TECH GROUP DEVELOPS RUGGED MIL ½ SHORT ATR CHASSIS

1 Oct
6 Mar
2014
2024
|
Polyrack Tech-Group

The POLYRACK TECH-GROUP has developed an ATR system (Air Transportation Rack) for use in rough mechanical, climatic, chemical and electrical environments. The rugged MIL ½ short ATR chassis is designed according to ARINC 404A and has five 3U slots with Open VPX profile. The chassis conforms to VITA 65 and operates at a data transfer rate of up to 10Gbit/s. Dip brazed, the casing offers a completely sealed environment and assists passive "conductive cooling" by conducting the heat effectively away from the board and power supply unit.

You can read the complete press relase
You can read the complete press relase
Teilen:
Blog

POLYRACK TECH GROUP DEVELOPS RUGGED MIL ½ SHORT ATR CHASSIS

1 Oct
6 Mar
2014
2024
|
Polyrack Tech-Group

The POLYRACK TECH-GROUP has developed an ATR system (Air Transportation Rack) for use in rough mechanical, climatic, chemical and electrical environments. The rugged MIL ½ short ATR chassis is designed according to ARINC 404A and has five 3U slots with Open VPX profile. The chassis conforms to VITA 65 and operates at a data transfer rate of up to 10Gbit/s. Dip brazed, the casing offers a completely sealed environment and assists passive "conductive cooling" by conducting the heat effectively away from the board and power supply unit.

Vous pouvez lire le communiqué de presse complet
Vous pouvez lire le communiqué de presse complet
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