POLYRACK auf der SPS 2019: Gehäuse- und Systemapplikationen für individuelle Anforderungen
Die POLYRACK TECH-GROUP präsentiert vom 26. bis 28. November 2019 auf der SPS in Nürnberg (Halle 3C, Stand 531) neben einer Vielzahl an Gehäusesystemen auch kundenspezifische Systemapplikationen aus verschiedenen Branchen und Einsatzgebieten inklusive Elektronikintegration und Auswahl von HMI- und MMI-Anwendungen.
Für die Steuerungs- und Antriebstechnik, insbesondere für industrielle Umgebungen, präsentiert POLYRACK die PanelPC 2-Serie. Diese Panel-PC-Lösungen der Schutzklasse IP54 sind in Größen von 10,1‘‘ bis 21,5‘‘ sowie in unterschiedlichen Materialvarianten von gefrästem Aluminium bis hin zur Blechbiegelösung verfügbar. Als Bedienoberfläche stehen resistive Single-Touch- oder Multi-Touch-fähige kapazitive Touchscreens (PCAP) in unterschiedlichen Glasstärken zur Auswahl. So können beispielsweise auch Bedienkonzepte mit Gestensteuerung für eine smarte Produktion projektiert werden. Kundenspezifische Bedruckung und Anti-Fingerprint-Beschichtungen sind auf Wunsch möglich. Um die Vorteile unterschiedlicher Werkstoffe zu nutzen, stehen Kunden für die Realisierung individueller Anforderungen außerdem weitere Technologien zur Materialauswahl zur Verfügung, wie z.B. Kunststoff und Guss - auch in Materialkombination.
Small Form Factor mit EmbedTEC: Das Aluminium-Tischgehäuse ist die elegante Verpackung für kleine Formfaktoren wie embedded NUC (eNUC), pico-ITX (pITX, 2,5“), SMARC, QSeven und SBCs wie den Raspberry Pi. Es verfügt über ein austauschbares I/O-Shield und einen massiven Aluminiumdeckel zur Wärmeabfuhr. Für höhere Leistungen lässt sich dieser durch einen Kühlkörper ersetzen, perforierte Seitenwände und Ventilatoren steigern die Kühlleistung bei Bedarf nochmals. Für Anwendungen im Bereich Automatisierung und IoT bietet POLYRACK zudem vielfältige Anpassungen und Montageoptionen.
Weitere Gehäuseserien wie SmarTEC für hochwertige Systeme wie passiv gekühlte Mini-PCs, EmbedTEC für Embedded Computing und HMI-Anwendungen sowie Backplanes für den High-Speed-Bereich mit den Standards VPX und CompactPCI Serial vervollständigen das Portfolio des Gehäusespezialisten POLYRACK. Alle Lösungen zeichnen sich durch passendes Zusammenspiel von Mechanik, Kunststoff, Elektronik und dem Oberflächenfinish aus – abgestimmt auf den Zielmarkt.
POLYRACK AT SPS 2019: CASE AND SYSTEM APPLICATIONS FOR INDIVIDUAL REQUIREMENTS
The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from November 26th to 28th 2019 at the SPS in Nuremberg (Hall 3C, Booth 531). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the control and drive technology, particularly for industrial environments, POLYRACK presents its PanelPC 2-series. These Panel-PC-solutions comply with the protection class IP54 and are available in sizes from 10.1” to 21.5” as well as in different materials such as milled aluminium or sheet metal bending solutions. Resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses are options for the user interface. For example operating concepts with gesture control may be projected for smart production operating as well. Customer specific printing and anti-fingerprint coating are available on request. In order to use the advantages of different materials, other technologies are available for customers to realize individual requirements in materials, such as plastics and cast components – also in a material combination.
Small Form Factor with EmbedTEC: The aluminium desktop case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5“), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminium cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automatization and IoT.
Supporting enclosure series like SmarTEC for high quality systems such as passive cooled Mini-PCs, EmbedTEC for Embedded Computing and HMI-applications as well as Backplanes for the high-speed domain based on VPX and CompactPCI serial standards are complementary to the product portfolio of the electronic packaging specialist POLYRACK. All solutions are characterized by matching interaction of mechanics, plastics, electronics and surface finish – fine-tuned to the target market.
POLYRACK AT SPS 2019: CASE AND SYSTEM APPLICATIONS FOR INDIVIDUAL REQUIREMENTS
The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from November 26th to 28th 2019 at the SPS in Nuremberg (Hall 3C, Booth 531). Customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the control and drive technology, particularly for industrial environments, POLYRACK presents its PanelPC 2-series. These Panel-PC-solutions comply with the protection class IP54 and are available in sizes from 10.1” to 21.5” as well as in different materials such as milled aluminium or sheet metal bending solutions. Resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses are options for the user interface. For example operating concepts with gesture control may be projected for smart production operating as well. Customer specific printing and anti-fingerprint coating are available on request. In order to use the advantages of different materials, other technologies are available for customers to realize individual requirements in materials, such as plastics and cast components – also in a material combination.
Small Form Factor with EmbedTEC: The aluminium desktop case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5“), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminium cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automatization and IoT.
Supporting enclosure series like SmarTEC for high quality systems such as passive cooled Mini-PCs, EmbedTEC for Embedded Computing and HMI-applications as well as Backplanes for the high-speed domain based on VPX and CompactPCI serial standards are complementary to the product portfolio of the electronic packaging specialist POLYRACK. All solutions are characterized by matching interaction of mechanics, plastics, electronics and surface finish – fine-tuned to the target market.
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